Microsemi Corporation Staff IC Package Engineer in Bangalore, India

About the Job:

Division: Mixed-Signal Development Group, Advanced Engineering Services

Location: Bangalore, India

Title: Staff, IC Package Engineer

The Mixed Signal Development Group is responsible for delivering analog and mixed-signal IP to divisions within Microsemi. We work with leading edge CMOS processes to produce analog integrated circuits for storage and wireline applications. From T1/E1 to 56Gb/s SERDES, we enable technology that allows Microsemi's products to interface to the outside world.

As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team leader/manager, and be engaged in the package design and layout.

Responsibilities:

  • Conduct package routing feasibility and layouts for Microsemi high-speed products, including MCM packages
  • Perform simple PCB breakout studies for ball map feasibility
  • Identify key issues for proposed designs based on silicon floor plans and desired package sizes
  • Work with signal integrity engineers to implement high speed signal routes and quiet power routes
  • Work with reliability engineers and external vendors to ensure manufacturability of package designs
  • Create package routing constraints based on signal integrity routing rules
  • Interact with and oversee work of external and internal package designers
  • Produce package routing reports and diagrams for review by external teams
  • Create and track package design schedules
  • Guide and assist external design teams on creation of input data for package design flow.

Qualifications:

  • Applicable Bachelor's or Master's Degree
  • 8+ years of industry experience
  • Expert in package design using Cadence APD
  • Expert in authoring APD design rules
  • Scripting in PERL or SKILL is an asset
  • Familiarity with flip chip and wire bond package designs
  • Familiarity with PCB design and BGA fanout issues
  • Understanding of high speed and power routing rules/issues
  • Capable of handling multiple tasks at once
  • Customer oriented, with attention to detail

Qualifications:

  • Applicable Bachelor's or Master's Degree
  • 8+ years of industry experience
  • Expert in package design using Cadence APD
  • Expert in authoring APD design rules
  • Scripting in PERL or SKILL is an asset
  • Familiarity with flip chip and wire bond package designs
  • Familiarity with PCB design and BGA fanout issues
  • Understanding of high speed and power routing rules/issues
  • Capable of handling multiple tasks at once
  • Customer oriented, with attention to detail

Equal Opportunity Employer Minorities/Women/Protected Veterans/Disabled