Microsemi Corporation Staff Device Design Engineer in Bend, Oregon
Microsemi's Discrete Products Group (DPG) offers one of the industry's most comprehensive power and RF/microwave discrete semiconductor product portfolios. The DPG encompasses two business units, the Power Discrete & Modules BU and the RF/Microwave Discretes BU. Markets the PDM & RF/MW Discretes BUs address include: alternative energy, industrial, medical, defense, commercial aviation, communications, embedded systems, motor control, power solutions, sensors, and security.
The engineer in this position will be responsible for developing new discrete power semiconductor families of products on SiC and Silicon. Development and introduction of new products are driven from the marketing group and the successful candidate should be able to conceive a new design based on specifications received from the end user of this new product line.
This position requires frequent interfacing with marketing and as well as with various process engineering and assembly groups. The engineer must be a self-starter and carry-out diverse tasks from design and simulation to the failure analysis with his own hands as it is typical in a small but energetic company environment.
-A BS Degree in EE or Physics and a minimum of 7 years of experience in the design, fabrication, and characterization of power transistors, with emphasis on the design and manufacturing of discrete power semiconductors on WBG materials.
-Proficiency with TCAD tools (Synopsis, Silvaco or similar) and proficiency in layout design are mandatory requirements.
-Hands-on experience with advanced electrical characterization tools (Agilent/HP4145 or the likes) is essential.
-Good report writing, communication, and presentation skills are a must.
-The ideal candidate will have an MSEE or Ph.D. in electrical engineering and/or solid-state physics.
-Advanced course work and graduation thesis in modeling, simulation and evaluations of power devises preferred.
-It is preferred that the candidate have been involved in the design, development, and qualification of product lines of power semiconductors aimed for mass production.
-In depth knowledge of process steps required to make a power semiconductor (Implants, oxidations, depositions and etches, and metallizations) preferred.
-Knowledge and understanding of the interaction of the power semiconductor die with discrete packages or power modules is a plus.
-US Citizenship/Permanent US Residency requirements as outlined below:
This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Microsemi is an EEO/AAP employer and we do not discriminate on the basis of race, religion, national origin, sex, sexual orientation, age, physical or mental disability, marital status, veteran status or status as a disabled veteran.
Microsemi offers market-based salaries and competitive packages, including 401K, Medical, Dental, Vision and Education Reimbursement.
Equal Opportunity Employer Minorities/Women/Protected Veterans/Disabled