Microsemi Corporation Wafer Fab Operator in Bend, Oregon

Microsemi Corporation (MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally.

Microsemi's Discrete Products Group (DPG) offers one of the industry's most comprehensive power and RF/microwave discrete semiconductor product portfolios. The DPG encompasses two business units, the Power Discrete & Modules BU and the RF/Microwave Discretes BU. Markets the PDM & RF/MW Discretes BUs address include: alternative energy, industrial, medical, defense, commercial aviation, communications, embedded systems, motor control, power solutions, sensors, and security.

SUMMARY

Will process wafers in a cleanroom environment following written specifications and performing multiple operations. Will be responsible for manual data entry on process travelers, SPC charts and log books, and computer data entry for lot tracking and equipment tracking. Will interface with multiple people and multiple funtions.

ESSENTIAL DUTIES AND RESPONSIBILITIES

Include the following. Other duties may be assigned:

Interact with all levels of employees to increase output, reduce waste, standardize work instructions, incorporate continuous improvement, and improve communications and cooperation between departments.

Engage in daily production operation and anticipate product problems (i.e. so that loss of work hours is minimized and production objectives are met.

Perform wafer fabrication functions in the production of semiconductor devices. Operate equipment in performing alignment, masking, etch, deposition and diffusion.

Exchange timely information with other team members on product flow and workforce needs.

Demonstrate a keen awareness of safety practices and familiarity with OSHA standards.

Perform technical writing creating and updating technical documents and process/work specifications.

LANGUAGE SKILLS

Ability to read, analyze, and interpret common scientific and technical documents. Respond to common inquiries or complaints from customers, and regulatory agencies.

MATHEMATICAL SKILLS

Apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations. Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.

OTHER SKILLS AND ABILITIES

Must have very good hand and finger dexterity to use basic machine tools, handle small parts, and work from schematics and sketches. Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations. Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.

COMPUTER SKILLS

Must have practical working knowledge of MS Excel and MS Word. SPC experience a plus.

REASONING ABILITY

Solve practical problems and deal with a variety of concrete variables in situations where only limited standardization exists. Ability to use electronic theory and interpret a variety of instructions furnished in written, oral, diagram, or schedule form.

PHYSICAL DEMANDS

While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to use hands to finger, handle, or feel. The employee is occasionally required to stand; sit; reach with hands and arms; climb or balance; stoop, kneel, crouch, or crawl; and smell. The employee must frequently lift and/or move up to 10 pounds and occasionally lift and/or move more than 25 pounds.

WORK ENVIRONMENT

The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

While performing the duties of this job, the employee is regularly exposed to fumes. The employee frequently works with or near chemicals and mechanical equipment including high temperature furnaces, electron beam evaporators, equipment that uses UV light sources, microscopes and RF plasma tools. The employee is occasionally exposed to moving mechanical parts, risk of electrical shock and vibration. Work is primarily performed in a clean room manufacturing environment. The noise level in the work environment is usually moderate. Temperatures in the work environment can range from 50 degrees F to 85 degrees F.

US Citizenship/Permanent US Residency requirements as outlined below:

This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

  • Requires limited job knowledge of systems and procedures and ability to follows basic work routines and standards
  • Requires a minimum of a High School Degree (or GED)
  • Requires no prior experience

US Citizenship/Permanent US Residency requirements as outlined below:

This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Microsemi is an EEO/AAP employer and we do not discriminate on the basis of race, religion, national origin, sex, sexual orientation, age, physical or mental disability, marital status, veteran status or status as a disabled veteran.

Microsemi offers market-based salaries and competitive packages, including 401K, Medical, Dental, Vision, Education Reimbursement, and Profit Sharing.

Must be available to work overtime and Saturdays as required.

No relocation package available.

All shifts available.

Equal Opportunity Employer Minorities/Women/Protected Veterans/Disabled