Microsemi Corporation Wafer Fab Operator, 2nd shift in Lawrence, Massachusetts

Microsemi's Discrete and Integrated Solutions Group (DISG) offers one of the industry's most comprehensive power and RF/microwave discrete semiconductor product portfolios. The DISG encompasses two business units, the Power Discrete & Modules BU and the RF/Microwave Discretes BU. Markets that the PDM & RF/MW Discretes BU's address include: alternative energy, industrial, medical, defense, commercial aviation, communications, embedded systems, motor control, power solutions, sensors and security. Microsemi is planning to fill the following 2nd shift position with a talented, creative and motivated individual. A generous package is offered to all regular full time employees.

Summary:

Perform wafer fabrication functions in the production of semiconductor devices in a cleanroom environment by following written specifications and performing multiple operations.

Essential Duties and Responsibilities:

  • Package loose die in waffle packs, clean die, pick die off of tape with Royce equipment, and visually inspect die with microscope. Understanding of Mil STD 2072 / 2073 die inspection criteria.
  • Dice wafers with automated Disco equipment, removing die from tape.
  • Grind and sand blast wafers.
  • Responsible for manual data entry on process travelers, SPC charts and log books, and computer data entry for lot tracking and equipment tracking.
  • Work on assignments under general supervision.
  • Learn the process flow of the various wafer fab functions.
  • Interact with all levels of employees to increase output, reduce waste, standardize work instructions, incorporate continuous improvement, and improve communications and cooperation between departments.
  • Engage in daily production operations and anticipate product problems (i.e. so that loss of work hours is minimized and production objectives are met).
  • Exchange timely information with other team members and management on product flow and workforce needs.
  • Demonstrate a keen awareness of safety practices and familiarity with OSHA standards.
  • Create and update technical documents and process/work specifications.
  • Other duties as assigned.

Microsemi targets candidates who value teamwork, have effective interpersonal skills, and respect the technical leadership and structured processes that we utilize to build our world-class products.

Physical Demands

The physical demands are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. While performing the duties of this job, the employee is regularly required to stand, sit, bend, reach, walk, push, pull, climb or balance; stoop, kneel, crouch, or crawl; smell; and use hands to repair, finger, handle, or feel. Must have very good hand and finger dexterity to use basic machine tools, handle small parts, and work from schematics and sketches. Specific vision abilities required by this job include close vision, distance vision, depth perception, ability to adjust focus and use of microscope. The employee is often required to talk or hear. The employee must occasionally lift and/or move up to 10-25 pounds unassisted.

Work Environment

The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.While performing the duties of this job, the employee is regularly exposed to fumes. The employee frequently works with or near chemicals and mechanical equipment including high temperature furnaces, electron beam evaporators, equipment that uses UV light sources, microscopes and RF plasma tools. The employee is occasionally exposed to moving mechanical parts, risk of electrical shock and vibration. Work is primarily performed in a clean room manufacturing environment. The noise level in the work environment is usually moderate. Temperatures in the work environment can range from 65 degrees F to 85 degrees F.

Required Qualifications:

  • 2+ years of business experience, preferably working in a wafer fab or manufacturing environment.
  • High School Diploma or GED.
  • Highly motivated and ability to work well with people.
  • Aptitude to learn new skills.
  • Ability to communicate well in English, both verbal and written.
  • Ability to perform basic math skills.
  • Ability to read, analyze, and interpret common scientific and technical documents.
  • Respond to common inquiries or complaints from customers, and regulatory agencies.
  • Steady eye to hand coordination and good observation skills.
  • Good hand and finger dexterity to handle wafers without damaging them.

Preferred Qualifications:

  • Practical working knowledge of MS Excel and MS Word.
  • SPC experience.

ITAR StatementThis job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b(a)(3).

Equal Opportunity Employer Minorities/Women/Protected Veterans/Disabled